| Attribute |
Std |
Adv |
2000 |
2002 |
2004 |
| Minimum Line/Spacing, Internal Layer (mils) |
5/5 |
4/4 |
3/3 |
2/2 |
1.5/1.5 |
| Minimum Line/Spacing, External Layer (mils) |
5/5 |
4/4 |
3/3 |
2.5/2.5 |
2/2 |
| Minimum Drilled Hole Size (mils) |
12 |
10 |
8 |
8 |
6 |
| Aspect Ratio (Thickness to Drill) |
6:1 |
8:1 |
10:1 |
14:1 |
16:1 |
| Land Size (Diameter over Drill, mils) |
12 |
10 |
8 |
6 |
5 |
| No-Connect (Diameter over Drill, mils) |
24 |
20 |
18 |
16 |
14 |
| Plated Hole Tolerance (mils) |
+/- 3 |
+2/-3 |
+/- 2 |
+/- 1.5 |
+/- 1 |
| Minimum Laser Via Hole Diameter (mils) |
-- |
4 |
3 |
3 |
2 |
| Laser Via Aspect Ratio (Drill Diameter/Depth) |
-- |
2:1 |
1.5:1 |
1:1 |
1:1 |
| Laser Via Land Size (Diameter over Drill, mils) |
-- |
8 |
6 |
5 |
4 |
| Minimum Dielectric Thickness (mils) |
4 |
3 |
2.2 |
1.7 |
1.3 |
| Maximum PCB Thickness (inches) |
.093 |
.125 |
.187 |
.250 |
.250 |
| Thickness Tolerance (% of Thickness) |
10 |
6 |
5 |
5 |
5 |
| Maximum Board Dimensions (inches) |
16 x 22 |
22 x 28 |
22 x 28 |
22 x 28 |
22 x 28 |
| Bow and Twist (%) |
0.75 |
0.5 |
0.5 |
0.5 |
|
| Minimum Conductor to Edge (mils) |
15 |
10 |
10 |
7 |
5 |
| Layer-to-Layer Registration Tolerance (+/- mils) |
4 |
3.5 |
3 |
3 |
2 |
| Component Pitch (mils) |
20 |
16 |
8 |
5 |
4 |
| Soldermask Clearance (mils) |
3 |
2.5 |
2 |
1.5 |
1 |
| Impedance Tolerance (%) |
10 |
10 (diff) 7 |
5 |
5 |
|
| |
| Electrical Test Method |
|
|
|
|
|
| 100 mil grid |
X |
X |
X |
X |
X |
| 70 mil grid |
|
X |
X |
X |
X |
| 50 mil grid |
|
|
|
X |
X |
| Flying Probe |
X |
X |
X |
X |
X |
| Non-Contact |
|
|
|
X |
X |
| |
| Materials |
|
|
|
|
|
| FR4 High Tg -- 170C |
X |
X |
X |
X |
X |
| FR4 High Tg -- 200C |
|
|
|
X |
X |
| Polyimide & GETEK |
|
X |
X |
X |
X |
| Low Loss/High Speed |
|
|
X |
X |
X |
| Low Dk & RF |
|
|
X |
X |
X |
| |
| Via Construction |
|
|
|
|
|
| Through Hole |
X |
X |
X |
X |
X |
| Blind (Mechanical) Sequential Lamination |
|
X |
X |
X |
X |
| Blind (Laser) Controlled Depth |
|
X |
X |
X |
X |
| Buried (Mechanical) |
X |
X |
X |
X |
|
| Buried (Laser) |
|
|
X |
X |
X |
| |
| Build-Up |
|
|
|
|
|
| 1-Core-1 |
|
X |
X |
X |
X |
| 2-Core-2 |
|
|
X |
X |
X |
| Combinations |
|
|
X |
X |
X |
| |
| Surface Finish |
|
|
|
|
|
| HASL |
X |
X |
X |
X |
X |
| OSP |
X |
X |
X |
X |
X |
| Electroless Nickel/Immersion Gold |
X |
X |
X |
X |
X |
| Electrolytic Nickel/Gold |
X |
X |
X |
X |
X |
| Immersion Silver |
|
|
X |
X |
X |
| White Tin |
X |
X |
X |
X |
X |
| No-Lead Compatible |
|
|
? |
X |
X |
