Smaller and Faster Components

• Handheld: More features (video, cameras)
  • While maintaining the same or smaller size
  • Density focus

• Telecom / IT Infrastructure: More data
  • Faster signals mean a need for different
    or refined laminate and foils and in some
    cases interconnect structures
  • Signal speed focus

Smaller = Density Development

• BGA pitch – What it means and why it matters
  • Pitch: The measurement from pad center to pad center
  • Standard Pitch for BGA's
    • 1.27mm = 50.0 mils
    • 1.00mm = 39.4 mils Mechanical drills typically used
    • 0.80mm = 31.4 mils

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    • 0.65mm = 25.6 mils
    • 0.50mm = 19.7 mils Micro-vias typically used
    • 0.40mm = 15.7 mils
  • Pin or I/O count is the 2nd important aspect of pitch
    • Lower pin counts are easier to rout, requires fewer layers

• Advanced interconnects
  • Special interconnect methods become necessary to achieve routing needs

• Interconnect structures - HDI, laser via
  • Copper-Filled Microvias
    • Allows for stacking of microvias to enable higher pin count BGA's
    • Necessary to build medium to high pin count 0.50mm pitch BGA's
    • Reduces potential for solder ball voiding and out gassing during assembly