Smaller and Faster Components

printed circuit board home page

Capabilities
PCB Quote
Technology Roadmap
Contact

 

Different electronics segments need unique technical capabilities and focus on fundamentally different problems

  • Handheld: More features (video, cameras)
    • While maintaining the same or smaller size
    • Density focus
Handheld
  • Telecom / IT Infrastructure: More data
    • Faster signals mean a need for different
      or refined laminate and foils and in some
      cases interconnect structures
    • Signal speed focus
Telecom / IT Infrastructure

Smaller = Density Development

  • BGA pitch – What it means and why it matters
    • Pitch: The measurement from pad center to pad center
    • Standard Pitch for BGA's
      • 1.27mm = 50.0 mils
      • 1.00mm = 39.4 mils Mechanical drills typically used
      • 0.80mm = 31.4 mils
      • 0.65mm = 25.6 mils
      • 0.50mm = 19.7 mils Micro-vias typically used
      • 0.40mm = 15.7 mils
    • Pin or I/O count is the 2nd important aspect of pitch
      • Lower pin counts are easier to rout, requires fewer layers
BGA pitch
 
  • Advanced interconnects
    • Special interconnect methods become necessary to achieve routing needs

 

  • Interconnect structures - HDI, laser via
    • Copper-Filled Microvias
      • Allows for stacking of microvias to enable higher pin count BGA's
      • Necessary to build medium to high pin count 0.50mm pitch BGA's
      • Reduces potential for solder ball voiding and out gassing during assembly

Matrix Sales
15466 Los Gatos Blvd. #109-374
Los Gatos, CA  95032
Phone: (408) 354-4271
Fax: (408) 354-7242
info@matrixsales.com

 

underwriters laboratories ulbellcore compliant iso 9002

Website design: Sessionware Inc.