Thermal Management

Thermal Management - Passive

TM Passive: Heatsink material is not a active part of the PCB. The PTH’s DO NOT make direct contact to the material

Heatsink can be bonded externally or sandwiched between two PCB’s

Passive Heatsink Materials

• Copper
• Aluminum
• Copper Invar Copper (CIC)
• Copper Moly Copper (CMC)
• Beryllium Composites
• Liquid Flow Thru

Markets: Mil/Aero

Thermal Management - Active

• TM Active: Heatsink material is an active part of the PCB where PTH’s &/or cavities making direct contact to the heatsink. Referred to as Thermal Plane
  
  
• Active Heatsink Materials
  • Copper
  • Copper Invar Copper (CIC)
  • Copper Moly Copper (CMC)
    
    
• Typical Thicknesses
  • .010 - .062
    
    
• Markets:
  • Mil/Aero &
  • Specialty Commercial